By J. W. Morris Jr. (auth.), R. P. Reed, A. F. Clark (eds.)
The 6th foreign Cryogenic fabrics convention (ICMC) was once hung on the campus of Massachusetts Institute of know-how in Cambridge in col laboration with the Cryogenic Engineering convention (CEC) on August 12-16, 1985. The complementary application and the interdependence of those dis ciplines foster the convention. Its show up goal is sharing the newest advances in low temperature fabrics technological know-how and expertise. both im portant, parts of wanted study are pointed out, prioriti-es for brand new study are set, and an elevated appreciation of interdisciplinary, interlaboratory, and foreign cooperation ensues. The luck of the convention is the results of the. capable management and tough paintings of many of us: S. Foner of M.I.T. coordinated ICMC efforts as its convention Chairman. A. I. Braginski of Westinghouse R&D middle deliberate this system with the help of Cochairmen E. N. C. Dalder of Lawrence Livermore nationwide Laboratory, T. P. Orlando of M.I.T., D. O. Welch of Brookhaven nationwide Laboratory, and various different committee participants. A. M. Dawson of M.I.T., Chairman of neighborhood preparations, and G. M. Fitzgerald, Chairman of certain occasions, skillfully controlled the joint convention. The contributions of the CEC Board, and especially its convention chairman, J. L. Smith, Jr. of M.I.T., to the association of the joint convention also are gratefully acknm.ledged.
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Extra info for Advances in Cryogenic Engineering Materials
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Design Margins in a Large Coil In a large coil the current density is usually limited by the stability of the superconductivity or coil protection. With the present technique, however, the superconducting material has enough high current density that it is unaffected by these limiting factors. Therefore, the current margin is automatically high. The present cryogenic structural materials have not been specially developed for cryogeni c applications.. Thus, their performance is 11mi ted by their physical properties.
Alloy 2090 is an AI-Li alloy that was designed to combine high strength and toughness with low density for aerospace use, and has a strength-toughness combination at room temperature that exceeds that of the best available aerospace alloys. The cryogenic properties of this alloy have recently been measured 27 and are presented in Figure 17, where they are compared with those of 2219 and with the trend line for the room temperature I'roperties of advanced aerospace aluminum alloys. Note that this alloy has an exceptional combination of strength and toughness at 4 K.
Advances in Cryogenic Engineering Materials by J. W. Morris Jr. (auth.), R. P. Reed, A. F. Clark (eds.)